Mechanics coupling to sensitivity analysis Integration of CST MWS &endash radiation /irradiation Integration of CST MWS &endash geometry part Optimized 3D finite-element solver for PI applications More intuitive emission model entries (Temperature instead of energy) Parallel direct solver can be used in EMSĬapacitance and inductance computation for Tet solversĬonductivity can be defined for background material Improved robustness for adaptive Tet computations (recovery on error/abort)Ģnd order for all tetrahedral EMS solvers Parallelization of near field calculation Based on ray-tracing technique (shooting and bouncing rays, SBR)Ĭalculates monostatic and bistatic scattering and RCS for PEC structures Tabulated surface impedance materials (Tet-FD, also for ports) Surface power loss density with power loss density monitor (Tet-FD)Īdditional mesh quality improvement with snapping (Tet-FD) Performance improvements (Tet-FD) in some parts of the solver runįield source monitor for exporting (Tet-FD) Homogeneously filled Floquet modes in media (not only vacuum) GPU: Usage of single card on 2 or 4 card solution Higher order dispersive materials (permittivity) Improved parallelization of matrix calculationīroadband field imprint for field sources Preserve assembly structure in navigation tree for CATIA V5 and Pro/E assemblies Support for Autodesk Inventor 2008/2009 files Material names of CATIA V5 files are imported
Solver Pause / Resume functionality including release license Improved material fitting with support of higher orders Improved usability of user interface for multiple open projects This list provides an overview of some of the most important changes in CST STUDIO SUITE™ 2010. Thermal coupling between tetrahedral & hexahedral mesh projects
Mechanics coupling to EM sensitivity analysis Improved Performance and Simplified Result handling optimizer) can be used with every license Strongly simplified modelling and import workflow EDA-Token licensing scheme for EDA-imports 2nd order tetrahedral elements for all solvers Easy model exchange with CST MICROWAVE STUDIO Integration into CST STUDIO SUITE / Link to CST DS Sensitivity and yield analysis (F-solver) Mixed-order elements up to 3rd order (F-solver) Higher-order dispersive materials (T-solver) Improved TET-adaptation snap to curvature
Interactive local modifications&constraints
I have no idea where you can download the latest installation files. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.Already released, and the latest version is SP1 now. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Infinite array modeling involves one or more antenna elements placed within a unit cell. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. A candidate array design can examine input impedances of all elements under any beam scan condition.